A Survey On Three-Dimensional Image Processing VLSI System And Its Applications

Three dimensional integrated circuits (3D IC) is an emerging technology to overcome the interconnect delay and power limitations. A 3D IC consists of two or more independently manufactured ICs that are vertically stacked on top of each other this is referred to as a tier. An interconnection between the tiers is made by through-silicon vias (TSV). Three dimensional (3D) ICs are capable of achieving better performance, functionality, and packaging density compared to more traditional planar ICs. On the other hand, NoC is also a solution for integrating large numbers of embedded cores in a single die. The RAM/ROM module system with reconfigurable memory architecture is used to enable flexible image data processing. The NoC system is also proposed to enable fast signal transmission and correct control operation. The semiconductor technology continues its advancement in 3D-IC circuit. The concept of 3D-IC introduces additional dimension in latest designs by using stack structures with through-silicon via (TSV). 3D ICs replace long interconnect in 2D ICs with TSV cells. The 3D image processing VLSI system can also be improved by suitable data storage and pipeline control flow. Better image VLSI system can be realized by elaborate network-on-chip system and precise 3D stacking layer design.